Direct-to-Chip Cooling for Data Centers
Direct to Chip Liquid Cooling for CPUs and GPUs
AI and high-performance computing (HPC) workloads are generating unprecedented heat in data centers, with processors at risk of throttling by 25% or more without adequate cooling. Traditional air-based methods are struggling to keep up — which is why more operators are turning to Direct-to-Chip (DTC) liquid cooling.
Direct-to-chip cooling is an advanced data center liquid cooling method that applies coolant directly to the server components that generate the most heat including CPUs and GPUs.
Data Center Challenges
-
Data Center Space- More computing power requires more hardware. Many IT teams are are finding that they are running out of space in their data centers.
-
Energy Costs- The financial strain of operating and cooling data center gear. Additionally, some operators have reached the energy limit of what the grid can provide.
-
Emphasis on Sustainability- With growing importance on sustainability and benchmarks, IT teams need to use less energy and water, not more.
How Direct to Chip Cooling can Help
- Increase rack density 2 to 3 times, especially for high-TDP clusters vs. non-cooled data centers
- Enable max GPU and CPU workload computing
- Compared to traditional air conditioning, DTC is 30 – 50% more efficient, reducing energy consumption and floor space
- Achieve PUE (Power Usage Effectiveness) of 1.04
- DTC technology is simple to deploy and retrofitable to most server devices
- Enhance thermal control, delivering predictable, consistent thermal performance. This prevents server throttling, sometimes needed with air cooling to keep the temperature down.
Key Benefits of Direct Liquid Cooling with Park Place
| Improved Energy Efficiency/Lower Operational Costs | 50–1000x more efficient than air cooling reducing energy consumption 25–30%, significant reduction in need for air conditioning |
| Minimized Environmental Impact | Reduced energy consumption translates to a smaller carbon footprint contributing to sustainability goals |
| Support for High TDP (Thermal Design Power) | CPUs and GPUs into thousands of watts per chip vs. 200–300x ceiling with air cooling |
| Increased Computing Density | More efficient cooling allows for higher server densities in racks |
| Enhanced Performance and Reliability | Components can operate at higher clock speeds without overheating, possibly extending their lifespan/reducing the frequency of replacements |
| Scalability | Can be scaled to meet the demands of high-performance computing environments |
| Simple Installation | Can be quickly applied to a singe server or an entire cabinet, with or without facility water |
A Comprehensive Direct to Chip Cooling Solution
Park Place Technologies can serve as a single-vendor solution for your direct liquid cooling applications. This includes:
- Procurement and installation of hardware for the direct to chip liquid cooling process.
- Maintenance of server and direct to chip cold plate.
- Ongoing performance and sustainability monitoring.
Park Place Technologies removes the complexities of the direct-to-chip liquid cooling journey – we serve as a single-vendor solution for the entire process.
